This team is dedicated to developing AI processing chips and systems for IoT intelligent perception applications (including visual, audio, smart wearables, and electromagnetic sensing). Through a co-design approach involving AI algorithms and chips, the team builds intelligent, low-power, and miniaturized AI solutions for smart sensing terminals. The team comprises 13 faculty members, including 7 professors/researchers (one of whom is a national-level high-caliber talent and two are national-level young talents) and 6 associate professors/associate researchers, along with over 100 doctoral and master's students. The team has led national-level projects such as the National Key R&D Program, the NSFC Joint Key Project, and NSFC General Projects, as well as industry-sponsored projects with renowned companies like Huawei and SenseTime. It is the responsible team at UESTC for the "National Engineering Laboratory for Advanced Microprocessor Technology" and leads the "Sichuan Provincial Engineering Technology Research Center for Unmanned System Intelligent Circuits and Systems." The team published UESTC's first-ever papers in top-tier conferences in their respective fields: ISSCC (chip design), VLSI (chip design), CICC (chip design), HPCA (architecture), and DAC (chip design automation). They have developed multiple milliwatt/microwatt-level ultra-low-power AI chips for visual, audio, and smart wearable applications, achieving the lowest power consumption among international peers while maintaining high accuracy and real-time performance. Their achievements have won multiple IEEE conference best paper awards, the Sichuan Provincial Science and Technology Progress Award, the WU Wenjun AI Technological Invention Award, the China Association of Inventions' Invention and Innovation Award, and the China Industry-University-Research Cooperation Innovation Award, receiving coverage from domestic and international media like EE Times and Jiwei. In recent years, students advised by the team have repeatedly won First Prizes in major national competitions, including the China Graduate "Chip" Innovation Competition, the China Graduate Electronics Design Contest, and the China Graduate AI Innovation Contest. The team's technological achievements have been transferred to or applied by well-known domestic and international companies (such as NXP, Huawei, Sugon, Huada Electronics, and Cmsemicon) and research institutes (like AVIC Chengdu Aircraft Design & Research Institute and CETC-54), serving major national demands and economic development.