From February 15 to 20, Professor Zhou Jun from the School of Information and Communication Engineering was invited as a Technical Program Committee (TPC) member to attend the International Solid-State Circuits Conference (ISSCC 2025) in San Francisco, USA. He organized a special session on chip demonstrations and engaged in in-depth discussions with engineers and scholars from Intel, IBM, Qualcomm, OpenAI, STM, MIT, Stanford, and other internationally renowned companies and universities. Additionally, he participated in the ISSCC 2026 TPC organizational discussion. ISSCC is the highest-level conference in the field of chip design, and Professor Zhou Jun is currently the only committee member from the Chinese mainland in the field of digital chips, including AI chips.